- Get link
- X
- Other Apps
Introduction: Choosing a high-density BGA packaging supplier comes down to three questions: can the substrate carry thousands of pins, will the package reflow cleanly on your assembly line, and when should design files move into engineering review? The decision usually arrives under schedule pressure. The die is taped out, the I/O count has outgrown what a leadframe package can hold, and the board team is asking how many routing layers the package will require. At that point the field narrows quickly, because few suppliers can build a BGA substrate with a dense bottom solder ball array and support the assembly process that follows. Focus first on substrate fit, reflow compatibility, and customization. Those three areas determine whether a supplier can carry a thousands-pin design from package geometry through assembly. What Makes a BGA Packaging Supplier Suitable for Thousands-Pin Designs Once a design crosses into the thousands of pins, board routing becomes a primary constraint. A ...